EVG discusses the latest wafer bonding system study results

(July 14, 2010) — In this video from SEMICON West 2010, Marcus Wimplinger, EV Group, summarizes the results of SEMATECH work using EVG’s 300mm bonding systems that enables submicron alignment. Highly accruate wafer bonding is used for Cu-to-Cu bonding and other packaging applications. Here, he speaks with senior technical editor Debra Vogler.

See all the latest from SEMICON West 2010 at: http://www.electroiq.com/index/Semiconductors/semiconwest2010.html

Read "Lithography and wafer bonding solutions for 3D integration," co-authored by Wimplinger, from Advanced Packaging, March 2010. Also attend the on-demand webcast presented by EVG, It’s Time For 3D Now – TSV Process Achievements


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