From SEMICON West: Reducing the cost of wafer-level packaging with Novellus

(July 15, 2010) — In this video from SEMICON West, Tim Archer, Novellus, illuminates trends in wafer-level packaging. Novellus’ new product announcements from the show can be found below the video. WLP has always faced cost challenges on the mass-market sectors, like consumer devices. WLP can reduce power consumption and package size. Novellus introduced several products at SEMICON West to increase deposition and removal productivity and advance the technology.

Novellus Announces New Suite of Products for the Advanced Wafer Level Packaging Market 
Novellus Systems (Nasdaq:NVLS) introduced new models of the company’s VECTOR PECVD, INOVA PVD, and GxT photoresist strip systems. 
Read the product information here: http://www.electroiq.com/index/display/packaging-wire-news/1221321518.html

Novellus Introduces SABRE 3D Electroplating System for the Advanced Wafer-Level Packaging Market 
Utilizing technology from Novellus’ SABRE Electrofill copper damascene interconnect system, SABRE 3D’s flexible and modular architecture delivers a range of high-productivity WLP processes, including copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-bumping. 
Read the product information here: http://www.electroiq.com/index/display/packaging-wire-news/1221321512.html

Get all the latest news, interviews, and more from SEMICON West 2010 at http://www.electroiq.com/index/Semiconductors/semiconwest2010.html

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