Military electronics cooling and thermal management issues press for new materials development, potential move away from COTS

Posted by John Keller, editor-in-chief of Military & Aerospace Electronics magazine

Electronics experts developing technology for aerospace and defense applications confront few issues as daunting as the heat generated from their designs. Engineers are under constant pressure to develop ever-smaller and more powerful electronics, yet the cost of doing so creates ever-larger amounts of heat, and ever-larger electronics thermal management problems.

Among their core challenges, then, is how to remove all this heat, while preserving system power and performance, as well as reducing size and weight for military and aerospace applications like unmanned vehicles, night-vision equipment, and body-worn computers, sensors, and signal processing.

Electronics heat removal and thermal management is pressing for the development of new materials to wick heat away from components on boards and in chassis, and also is providing incentive for systems designers to rethink their commitment to commercial off-the-shelf (COTS) technology.

Read the full article at Military & Aerospace Electronics, www.militaryaerospace.com

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