ROGERS teams RO4460 prepreg with RO4360 laminate for multilayer HF circuits

(July 27, 2010) — Rogers Corporation has developed a match for the RO4360 laminate: RO4460 prepreg. Both materials feature dielectric constant (Dk) of 6.15 ±0.15 and low dielectric loss of 0.003 at 2.5GHz. Together, they form an ideal system for fabricating compact, cost-sensitive multilayer high-frequency (HF) circuits in limited space.

As with RO4360 laminates, RO4460 prepregs are ceramic-filled, thermoset materials reinforced by woven glass for excellent mechanical stability. The laminate and prepreg supports smaller size circuits with excellent thermal conductivity of 0.8 W/m-K for effective thermal management.

RoHS-compliant RO4360 laminate and RO4460 bondply materials offer low coefficient of thermal expansion (CTE) of 30 ppm/°C in the z-axis for reliable plated through holes (PTHs) in multilayer circuits.

With its high +280°C glass transition temperature (Tg), the RO4360/RO4460 laminate system is processed like FR-4 circuit board materials. RO4360 laminate and RO4460 prepreg can be used with epoxy-based materials for hybrid multilayer circuits that take advantage of the smaller circuit features possible with 6.15 Dk materials. RO4360 laminate and RO4460 prepreg materials support automated manufacturing techniques and standard processing approaches for miniature, high-performance multilayer circuits without the high costs and processing complexity associated with PTFE circuit-board materials.

Rogers Corporation (NYSE:ROG), is a global technology leader in the development and manufacture of high performance, specialty-material-based products for a variety of applications in diverse markets. Rogers RO4460 prepregs are ceramic filled, thermoset materials reinforced by woven glass for excellent mechanical stability. To learn more, visit www.rogerscorp.com/acm. Read articles from Rogers Corporation, such as Embedded Passives in Device Packaging: What is Limiting Widespread Adoption  and Creating Wireless SiP Solutions

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