(July 19, 2010) — STATS ChipPAC Ltd. (SGX-ST: STATSChP) today announced that on July 19, 2010, the Company drew down US$150.0 million under the Credit Facility, and used the proceeds from this drawdown to redeem all US$150.0 million in outstanding principal amount of its 7.5% Senior Notes due 2010 (the "Notes") at their maturity on July 19, 2010. The Notes were redeemed at their principal amount, together with accrued and unpaid interest, pursuant to the terms and conditions of the Notes. Upon their redemption at maturity, all the Notes have been cancelled.

The Company entered into a US$360.0 million term loan facility agreement (the "Credit Facility") dated May 18, 2010 with, amongst others, certain of its wholly owned subsidiaries as guarantors and Bank of America, N.A., Credit Suisse AG, Singapore Branch, DBS Bank Ltd., Deutsche Bank AG, Singapore Branch, Oversea-Chinese Banking Corporation Limited, Sumitomo Mitsui Banking Corporation and United Overseas Bank Limited, as mandated lead arrangers. The proceeds from the Credit Facility are intended to repay certain of the Company’s indebtedness and for general corporate purposes. The interest rate payable under the Credit Facility will be determined by reference to LIBOR plus an applicable margin based on the Company’s then-applicable leverage ratio. The Credit Facility will mature on May 18, 2013.

STATS ChipPAC Ltd. is a service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. Further information is available at www.statschippac.com