(July 30, 2010) — Package on package (PoP) stacking makes use of the vertical space available on electronics printed circuit boards (PCBs). It increases density, fitting more silicon into the same footprint. However, package stacking can be difficult, as fine pitches require placement accuracy, and taller stacks generally face reliability issues, especially if the stack is reflowed improperly. So where should PoP stacking take place?

Take this short survey and tell us what you think, and why: http://www.surveymonkey.com/s/packageonpackage

Read about other 3D packaging technologies and read Advanced Packaging’s online feature about PoP rework from BEST Inc.