Assembleon intros back-end package assembly robot

(August 12, 2010)  — Royal Philips Electronics subsidiary Assembléon’s recently released Twin Placement Robot (TPR) will reportedly reduce costs for semiconductor backend manufacturing. The TPR fits on Assembléon’s A-Series pick & place equipment to give a single platform that can place up to 110,000 ICs and chip components per hour and assemble semiconductor dies in their packages. Plans are in the works for the TPR to do semiconductor manufacturing tasks as well.

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A single TPR can assemble all the major package types including naked dies, flip chips, stacked chips, Package-in-Package (PiP) and System in Package (SIP) devices. With the other A-Series robots placing up to 94,000 cph, the TPR helps match chip and IC placement rates to significantly reduce the overall cost of placement. Placing chips and ICs with the same machine saves labor, energy, maintenance and other operational costs of a separate line balancing machine, according to Assembleon. The A-Series suits high volume and high mix production, with fast New Product Introductions and batch sizes down to 1. The machines can pick ICs from a range of carriers including Jedec tray stackers and tape on reel.

The A-Series now has an accuracy of 25µm and repeatability of 17µm (both at 3 sigma, CpK>1), essential for reliable assembly of micro-miniature chip components and fine-pitch devices. Adding multiple TPRs and reducing the individual robot speeds to increase the settling time will soon also improve placement accuracy enough for A-Series machines to be used for encapsulating semiconductors at a much higher rate than is now possible.

For more information, visit www.assembleon.com

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