Fab metrology tool for non-critical layers enables future-proofing: Podcast with KLA-Tencor

(August 19, 2010) — Tom Gubiotti, product marketing manager at KLA-Tencor, discusses the design decisions that drove the company’s new film metrology tool — the Aleris 8330 — targeted for non-critical films at 32nm and below. Among the drivers — especially for memory manufacturers — is the need for high-throughput, low cost-of-ownership tools that are capable of recipe sharing around the fab, so-called, “future proofing.”  Gubiotti speaks with senior technical editor Debra Vogler.

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Figure 1. 3D map of film thickness results from Aleris 8330 spectroscopic ellipsometer. Data such as these can be used to monitor, control, and troubleshoot deposition, etch, and photo processes in the semiconductor manufacturing process.
Figure 2. Comparison of relative matching range and throughput performance for various film metrology tools. The current-generation tools provide the best matching performance for critical films (Aleris 8350) and best throughput for non-critical film applications (Aleris 8330).

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