(August 2, 2010) — Japan Marketing Survey Co. Ltd. (JMS) will publish "Outlook of thermal interface material market 2010) this week, with data on the semiconductor package thermal management market size by application, thermal interface material types’ market shares, and more.
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The thermal interface material (TIM) market is broken out by semiconductor package application and type. Market size forecasts go from 2009 to 2014. manufacturers’ shares (by application and material type) are calculated based on 2009 data. Applications include PCs, consumer electronics, infrastructure, automotive devices, and others. Types include solid TIMs, fluids, and phase change materials (PCM)
In the thermal filler market, market sizes (2009-2014) and manufacturers’ shares are given for alumina and boron nitride.
To order the report, visit JMS at http://www.jms21.co.jp/english.ver/report/syoseki/2010report/TIM_2010.htm
Read more about thermal interface materials here: http://www.electroiq.com/index/packaging/ap-materials/thermal-management.html
Read more about electronics manufacturing here: http://www.electroiq.com/index.html