(August 30, 2010) — Carsem, a provider of turnkey packaging and test services to the semiconductor industry, is aggressively expanding its micro leadframe package (MLP)/quad flat pack no-lead (QFN) package manufacturing capacity in both their Ipoh, Malaysia and Suzhou, China factory locations and are now capable of producing over 11 million units per day. This capacity expansion in assembly is matched with an equal proportion of test capacity expansion. 

Carsem MLPs are QFN and small outline no-lead (SON) type packages that are complaint to JEDEC’s MO220 and MO229 standards and are also offered with enhanced technologies such as copper-clip, flip-chip, system-in-package (SiP) as well as the extremely thin X3 version that is only 0.3mm thick.

The expansion will ensure uninterrupted chip package supply, said Rick Flowers, Carsem’s VP of worldwide sales and marketing.

Carsem is a provider of turnkey packaging and test services to the semiconductor industry, supplying Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. www.carsem.com.