Thermally conductive, low-viscosity epoxy features cryogenic serviceability

(August 12, 2010) — Master Bond EP30FLAO is a two-component epoxy resin system for high-performance potting, bonding, sealing and coating. It can be used in various cryogenic applications.

This low-viscosity epoxy with good flow characteristics can be used as a thermally conductive potting compound in the electronic, electrical, computer, metalworking, appliance and chemical industries where electrical insulation, environmental protection and heat transfer is required.

EP30FLAO features a service temperature range of 4K to 250ºF. Its thermal conductivity is 9-10 BTU/in/ft²/hr/ºF. The viscosity of the mixed compound is 5,000 to 6,000 cps at 75ºF. It has a low thermal expansion coefficient (CTE), superior dimensional stability, good physical strength and toughness.

Parts A and B are available in half pint, pint, quart, one gallon and five gallon containers.

Read more about Master Bond’s cryogenic epoxy formulations at

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