(September 22, 2010 – BUSINESS WIRE) — Tessera Technologies, Inc. (Nasdaq:TSRA) announced that Fujitsu Limited, provider of ICT-based business solutions, renewed its worldwide licensing agreement with Tessera’s semiconductor packaging subsidiary, Tessera Inc. Under the agreement, which was renewed in accordance with its original terms, Fujitsu is licensed to Tessera’s semiconductor packaging technology covering a broad range of chipscale and multi-chip package types.
“We are pleased Fujitsu has renewed its license agreement with us, extending the long-term commercial relationship between our two companies," said Henry R. Nothhaft, chairman and CEO, Tessera. “Tessera provides royalty-bearing licenses to a broad portfolio of semiconductor packaging intellectual property, which is used by leading members of the semiconductor industry worldwide. We continue our efforts to make our innovative technologies widely available, helping to enable the long-term growth of our served semiconductor markets.”
Tessera Technologies, Inc. invests in, licenses and delivers innovative miniaturization technologies for next-generation electronic devices. The company’s micro-electronics solutions enable smaller, higher-functionality devices through chip-scale, 3D and wafer-level packaging technology, as well as high-density substrate and silent air cooling technology. For information, go to www.tessera.com.
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