(September 28, 2010) — Indium Corporation’s global product manager, Andy C. Mackie, Ph. D., MSc, is presenting at the International Wafer-Level Packaging Conference (IWLPC), October 11-14, 2010 in Santa Clara, CA.
Dr. Mackie is presenting "Supply and Testing of Ultralow Alpha (<0.002cph/cm2) Assembly Materials" as part of the session on wafer level packaging. In addition, Dr. Mackie is a member of the 2010 IWLPC technical committee and is also chairing a session for the 3D packaging track.
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Mackie has over 20 years of experience in new product and process development and materials marketing in all areas of electronics manufacturing, including wafer fabrication, electronics assembly, and semiconductor packaging. He is an electronics industry expert in physical chemistry, surface chemistry, rheology, solder materials properties and processes (including solder paste printing), and reflow processes.
Dr. Mackie received the prestigious IPC President’s Award in 2001 for his leadership in both the Solder Paste Task Group and the Assembly and Joining Materials sub-committee. He is formally trained in Six Sigma "Design of Experiments" and has written papers and lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to pin-probe testing of flux residues. Additionally, Dr. Mackie holds patents in novel polymers, gas analysis, and solder paste formulation.
He has a PhD in Physical Chemistry from the University of Nottingham, UK, and a Masters of Science (MSc) in Surface and Colloid Chemistry from the University of Bristol, UK. Dr. Mackie is based at Indium’s global headquarters in Clinton, NY, USA. He is also the author of the Semiconductor / Power Semiconductor Assembly blog.
Sponsored jointly by the SMTA and Chip Scale Review Magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.