(September 3, 2010 – Marketwire) — Palomar Technologies introduced the fully automated 3800 Ultra Flexible Die Bonder, created for flexibility, high accuracy and precision.

The 3800 is based on Palomar’s three-generation Model 3500 Die Bonder. The 3.5 um repeatability 3 sigma and 2600 UPH over a 907.1 x 508mm work area enables its user to achieve high accuracy, precision and speed with flexibility in a wide variety of applications. Mutiple options include pulse heat and steady state stages for eutectic die attach applications.

Common applications include eutectic die attach, laser diode packaging and high-power LED packaging. Complex packages, often found in military, optoelectronic and medical devices industries, are well suited for the 3800. The 3800 is designed to eliminate additional bonders in the packaging facility.

Palomar Technologies provides high-precision wire bonders, gold wire bonders, die bonders and automated component placement systems. Find Palomar on the web at www.palomartechnologies.com. Visit Palomar’s blog at www.solutions.palomartechnologies.com.

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