(September 24, 2010) — Fujipoly released Sarcon 100GR-FL, a low resistance, durable thermal interface gap filler pad. The gel-like material is manufactured with an integrated nylon mesh layer that prevents distortion and stretching during die-cut operations.
When placed between a heat source such as a high-performance semiconductor and a nearby heat sink, Sarcon 100GR-FL will transfer heat with a thermal conductivity of 2.8W/m-K and a thermal resistance of .67°Cin2/W at 14.5 PSI. This 1.0mm thick, flame retardant thermal interface material (TIM) is available in sheets up to 300 × 200mm.
Fujipoly America Corporation, is a wholly owned subsidiary of Fuji Polymer Industries Co., Ltd. of Japan. Fujipoly America specializes in the fabrication of silicone rubber technology. Learn more at http://www.fujipoly.com.