(September 16, 2010) — A pre-competitive iNEMI R&D project plan, currently under development, will identify approaches capable of meeting wiring density needs for future generations of organic semiconductor packaging substrates. Meeting these future needs will require radical improvements and innovations in all aspects of organic packaging substrate technology. A piecemeal approach will not be sufficient.
The iNEMI team has developed a preliminary Statement of Work and would like to present the current project plan to gather input and comments from a larger industry group and to assess the level of interest in participating in the project. The iNEMI organization held a preliminary workshop on organic substrates in 2009.
A Webinar has been scheduled for Wednesday, September 22, 2010, starting at 5:00 PM Pacific Time (Thursday, September 23, 2010 at 8:00 AM in Asia). This meeting is open to anyone interested in reviewing and contributing to the plans. Copies of the draft Statement of Work will be distributed to everyone attending the webinar.
Use the following information to access the Webinar:
Topic: Wiring Density Program
Date: Wednesday, 22 September 2010
Time: 5:00 pm, PDT (San Francisco, GMT-07:00))
Meeting Number: 739 591 924
Meeting Password: (This meeting does not require a password.)
To join the online meeting
1. Go to https://inemi.webex.com/inemi/j.php?ED=131958442&UID=0&RT=MiM0
2. Enter your name and email address.
3. Enter the meeting password: (This meeting does not require a password.)
4. Click "Join Now".
For assistance, contact Jim Arnold at:
[email protected]
Mobile: +1-480-703-0133
Tel: +1-480-854-0906
Please send a note to Jim Arnold if the time slot for the review is inconvenient. If there are enough people interested, additional review sessions will be scheduled.
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