(September 21, 2010) — Laird Technologies Inc. released its new Tflex XS400 Series thermal gap filler. The product is a compliant elastomer gap filler for moderate thermal performance with a thermal conductivity of 2.0W/mK. This soft interface pad conforms with minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on mating parts.

Available in thicknesses from 0.020 through 0.200 inch in 0.010 inch increments, the Tflex XS400 thermal material is naturally tacky for easy assembly and no adhesive coating is required. Due to its TG (Tgard) liner on the other side, it is electrically insulating, stable from -40 to +160°C, and is certified to UL 94V0 flammability rating; complying with the limits of RoHS Directive 2002/95/EC and its subsequent amendments.

The Tflex XS400 gap filler is an easy-to-handle thermal pad that possesses low outgassing properties, suiting telecom, IT, consumer, automotive, LED, and power supply applications that require a gap pad between heat-generating components and heatsinks.

Laird Technologies provides high-performance and cost-effective thermal management solutions for applications in the medical, analytical, telecom, industrial, and consumer markets. For more information, visit www.lairdtech.com.

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