(October 28, 2010) — New Venture Research, a technology market research company, released "Advanced IC Packaging Technologies and Markets, 2010 Edition," a strategic report on the latest technologies in IC packaging, with forecasts of key markets. "Advanced IC Packaging Technologies and Markets, 2010 Edition," uses information from IC packaging industry insiders to present the most realistic forecasts available regarding advanced IC packaging.
The report covers stacked packages, through silicon vias (TSV), system in package (SiP), staggered inner row QFN, wafer level packages (WLPs) including fan-out (FOWLP) overmold style, and interconnect and bumping (flip chip, wafer bump, bare die on PCB, wire bond, etc).
It offers technology updates, research news, new products introduction news, an industry outlook, end markets and applications, and market analysis and forecasts through 2014.
Although IC shipments dropped significantly in 2009, it turned out to be merely a dip in the road. Volumes have already begun to move upward again in 2010, and customers will require an ever-increasing portfolio of advanced IC packaging technologies for growing applications.
The basics of package stacking, TSV interconnect methods, system in package (SiP) solutions and embedded substrates, and other packaging technologies (full list above) are investigated in terms of units, prices, revenue, applications, company releases, and more. It also contains a review of first-level package interconnection. Trends in wafer bumping are discussed extensively.
The report concludes with "State of the Industry, Where to Place Your Bets, and Applications for IC Devices," which predicts the ICs with the highest growth and detail product applications by vertical market such as computers, communications, consumer, industrial/medical and transportation and defense sectors.
Sandra Winkler is the senior analyst for IC packaging at New Venture Research (NVR) – formerly Electronic Trend Publications (ETP). She has authored all of NVR’s widely cited reports on IC packaging. She holds a MBA from Santa Clara University.
For more information on the report, visit www.newventureresearch.com
Subscribe to Solid State Technology/Advanced Packaging.
Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group