(October 18, 2010) — SET unveiled a patented system enabling a thorough removal of oxides before or during the semiconductor packaging bonding sequence. Addressing the challenges of the oxidation of metal surfaces in device bonding, this machine system encompasses a substrate chuck and a bond head with a non-contact localized confinement chamber that operates safely with reducing gases such as forming gas or formic acid vapor. It can be implemented on any new SET bonder models FC150 and FC300.

To preserve the standard capabilities of SET’s bonding tools and especially the low contact force measurement applied to the components, the "Semi-Open" Confinement Chamber has no hardware sealing. A non-contact virtual seal of the micro-chamber enables gas confinement for chip-to-chip or chip-to-wafer bonding under controlled atmosphere; it ensures gas collection and prevents oxygen intrusion while preserving the alignment of the device with respect to its substrate. Consequently, it ensures an excellent wetting and a higher quality of solder joints at reduced bonding forces and temperatures as well as higher yield as no cleaning step is required.

This technology breakthrough is a perfect answer to overcome the bonding challenges of demanding applications using AuSn and Indium, such as optoelectronics assembly (laser bar, VCSELs) and imaging sensors (IR-FPA).

SET, Smart Equipment Technology, is a supplier of high-accuracy die-to-die, die-to-wafer bonding and nanoimprint lithography solutions. SET is a wholly owned subsidiary of Replisaurus Technologies. Further information is available on www.set-sas.fr.

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