(October 5, 2010) — Global Industry Analysts released a report analyzes the global market for IC sockets in US$ Million by dual in-line memory module (DIMM) sockets, production sockets, test/burn-in sockets, and others. Regional IC sockets markets are analyzed as a consolidated whole with no granular level breakup offered by product group/segment. Annual estimates and forecasts are provided for the period 2006 through 2015.

The report profiles 44 companies including many key and niche players such as 3M Company, Aries Electronics Inc., Chupond Precision Co. Ltd., Enplas Corporation, FCI, Foxconn Technology Group, Johnstech International Corporation, Loranger International Corporation, Mill-Max Mfg. Corporation, Molex, Inc., Plastronics Socket Company, Inc., Sensata Technologies B.V., Tyco Electronics Ltd., Win Way Technology Co., Ltd., and Yamaichi Electronics Co., Ltd. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources. Sections cover recent product introductions and industry news.

Key discussions include the impact of the recession on the IC sockets market, changing market dynamics, the evolution of IC sockets and new developments, and how EMS companies impact IC socket use.

The product coverage in the report includes performance specs and socket types, such as plastic leaded chip carrier (PLCC), pin grid array (PGA), and land grid array (LGA) sockets used in production, and DIP and BGA sockets used in burn-in test.

Regional coverage is broken out by North America, Japan, Europe, the Asia-Pacific, and rest of world (ROW)

Learn more at http://www.electronics.ca/publications/products/IC-Sockets-%252d-Global-Strategic-Business-Report.html

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group