(October 1, 2010) — DEK has launched ProActiv process technology to enable electronics manufacturers to print pastes with high-density heterogeneous PCBs and ultra fine pitch assemblies such as advanced package assembly. Advanced printing can take place with a conventional printing process with a single thickness stencil.

As the stencil aperture area ratio decreases with the emergence of miniaturization and heterogeneous assemblies, the chance of successful printing decreases. Each ProActiv installation contains a control subsystem and a set of squeegees featuring embedded electronics. When activated, ProActiv energizes the paste that is in contact with or in very close proximity to the squeegee blade. This energizing action does not alter the paste but causes it to be far more compliant, improving the packing density of solder particles into apertures and enhancing the bond between those particles. In turn, this transforms solder paste transfer efficiency to deliver incremental improvements in quality, yield and throughput, even with today’s subassemblies.

DEK reports strong results after a ProActiv Beta Test program, enabling finer pitches, longer intervals between under-stencil cleaning, and fewer paste-print defects.

DEK is a global provider of advanced materials deposition technologies and support solutions including printing equipment platforms, stencils, precision screens and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture, and alternative energy component production. The technology is covered at www.dek.com/proactiv

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group