(November 15, 2010 – Marketwire) — Araca Inc., analytical products and services provider for chemical mechanical planarization (CMP) research and development, entered into a Master Services Agreement with Entrepix Inc., a global provider of CMP equipment and process services for semiconductors and advanced materials. Targeting CMP consumables suppliers, commercial device manufacturers, and academic research and development (R&D) organizations, the agreement enables customers to leverage the combined strengths of both companies with in-depth analysis and fundamental research for virtually any aspect of CMP on any material.
Under the agreement, Entrepix will bring Araca’s advanced CMP analysis capabilities to its comprehensive CMP foundry services portfolio. Effective immediately, Entrepix’ direct sales staff in the US, Singapore, China and Taiwan along with an international network of representatives in other major semiconductor manufacturing regions will actively market Araca’s portfolio of advanced analytical services to customers worldwide.
Araca services covered by the Master Services Agreement and now available through Entrepix include: CMP process characterization on single-wafer R&D polishers (200 mm and 300 mm), wafer metrology, functional testing of consumables (i.e. pads, slurries, post-CMP cleaning brushes and chemicals, diamond discs and retaining rings), dynamic mechanical analysis (DMA), slurry particle analysis, active diamond testing and diamond fracture/pullout testing (pad conditioners), numerical modeling/simulation, and advanced analytical techniques.
Araca Inc. provides analytical services related to characterization of advanced CMP processes and consumables. The company also manufactures fully instrumented single-platen R&D polishers for 200mm and 300mm applications. Visit www.aracainc.com for more information.
Entrepix Inc. provides chemical mechanical polishing (CMP) process outsourcing and equipment services. Entrepix also supplies CMP and metrology equipment to support customers’ internal processing requirements. The company’s comprehensive processing and equipment capabilities provide complete CMP solutions, from initial integration and optimization, through pilot production and high volume manufacturing. Visit www.entrepix.com for more information.
Subscribe to Solid State Technology/Advanced Packaging. Follow Solid State Technology on Twitter.com via editors Pete Singer, twitter.com/PetesTweetsPW and Debra Vogler, twitter.com/dvogler_PV_semi. Or join our Facebook group