IC-packaging-and-substrates report looks at type, volume

(November 15, 2010) — Japan Marketing Survey Co. Ltd. (JMS) published the report "IC Packaging & Substrate Report 2010." It covers production trends of major semiconductor package assemblers and substrate makers and the package market size through 2014, based on package type and electronics volume.

The production trend of major assemblers and substrate manufacturers section covers 30 major IC package assemblers and 16 major substrate manufacturers.

The 2008-2014 market size forecast includes analysis of the IC package assembly market trends on a quantity basis; by ball grid array (BGA), chipscale package (CSP), and system-in-package (SiP) type; by interconnection technology; by substrate type; by ball pitch size; and by IC type. The report also looks at substrate market trends by volume (SQM and PCs) and value basis; by BGA and CSP type; and by type and layer of substrate.

Japan Marketing Survey Co Ltd provides market surveys and consulting services, market survey related publishing, and technology surveys and consulting services. To order the report, visit http://www.jms21.co.jp/english.ver/report/syoseki/2010report/IC_PKG2010.htm

More IC packaging market analysis:

Packaging providers outgrowing semiconductor fab market: Gartner forecast

Flip chip and wafer-level packaging future, Alan Huffman

Advanced IC packaging report covers key techs, markets

 3D roadmaps begin to converge

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.