Intermolecular-Elpida-extend-R-D-collab-for-advanced-DRAM-technology

(November 4, 2010) — Intermolecular Inc. expanded its collaborative development program (CDP) with Elpida Memory Inc. (Tokyo SE: 6665), a global memory supplier. This new multi-year agreement focuses on research, development, manufacturing process transfer and high-volume yield-ramp support for multiple generations of DRAM technology. This agreement expands existing collaboration between the companies, which have worked together since 2007.

This engagement represents the most comprehensive collaboration to date between Elpida and Intermolecular. It includes near-term support for manufacturing process integration in 30 to 40nm technology nodes, and future support for more advanced materials, process and integration development for DRAM technologies between 20 and 30nm.

Engineers and technologists from both companies are working together at Intermolecular’s High-Productivity Combinatorial (HPC) R&D Center in California’s Silicon Valley using the proprietary HPC platform to increase experimental learning cycles by over 100× relative to conventional DRAM development methods. To ensure the efficient transfer of newly developed technologies into high-volume manufacturing, the joint teams are collaborating closely with Elpida’s production tool suppliers and their Hiroshima, Japan, production facility.

“Over the past few years, Intermolecular’s HPC technology and team members have become an important component of our DRAM R&D capability,” said Hideki Gomi, director and chief technology officer of Elpida. “We have seen new materials and processes move from early stage development into volume production with remarkable speed, and with significantly lower costs than would have been achieved in a more-traditional R&D model.”

Intermolecular Inc. delivers High Productivity Combinatorial (HPC) technology products and services that enable customers in the semiconductor and clean energy sectors to maximize their R&D ROI. Learn more at www.intermolecular.com.

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