(November 9, 2010) — Kulicke & Soffa Industries Inc. (Nasdaq: KLIC) introduced the IConnPS ProCu wire bonder optimized for copper wire bonding. The K&S IConnPS ProCu offers a significant and new level of capability for packaging lines transitioning from gold to copper wire bonding.

This is the latest addition to the Power Series product line, which offers high accuracy over a large bondable area for advanced packaging. It employs a combination of precisely designed new hardware, an optimized gas delivery system, and powerful new process controls to provide the most advanced system available for copper wire bonding. Specialized copper processes, ProCuBond and ProCuSSB, address the many challenges of bonding copper wire while delivering higher productivity. New process tools and features make the complex capabilities easy to use. A new cover gas delivery system enables a wide process window with less gas consumption. High precision gas regulation, metering, and filtering enables production stability.

In addition to wire bonders, K&S has been delivering innovative capillary solutions for fine copper wire bonding. The latest offering is the CuPRA3GTM, which delivers excellent bondability, extended life span, and workability with any copper wire type.

The IConnPS ProCu is currently being qualified with customers. Initial production shipments to customers are anticipated this quarter.

Kulicke & Soffa (NASDAQ: KLIC) designs and manufactures semiconductor and LED assembly equipment. Learn more at www.kns.com

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