(November 5, 2010 – GLOBE NEWSWIRE) — Maxim Integrated Products (Nasdaq:MXIM) qualified and shipped production analog product built on 300mm wafers. This gives Maxim a significant technology edge in the analog/mixed-signal market.
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Maxim is now producing 300mm wafers using its 180nm BCD analog process technology (S18) in Powerchip Technology Corporation’s wafer fab through a foundry agreement. This achievement gives Maxim a strategic advantage in the analog market, providing a capital-efficient manufacturing model that enables quick response to changing market conditions. It extends Maxim’s hybrid approach to wafer fab capacity, utilizing both in-house and outsourced wafer fabrication. This concept was introduced by Maxim in 2007 when MXIM partnered with Seiko Epson.
"Our manufacturing and R&D teams worked closely with Powerchip’s team to qualify Maxim’s S18 BCD technology for 300mm wafers in record time," commented Tunc Doluca, Maxim’s President and CEO.
Maxim Integrated Products is a publicly traded company that designs, manufactures, and sells high-performance semiconductor products. For more information, go to www.maxim-ic.com.
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