February 2, 2011 — Helios Crew Corporation (HCC) Taiwan released its LED product S35, a packaged component light-emitting diode (LED) that integrates MEMS with semiconductor processing to produce a unique silicon packaging technology.
In conjunction with a high-brightness SemiLEDs chip, this compact size, silicon sub-mount technology delivers brightness and reliability. In addition, the S35 silicon has a thermal conductance more than 8 times higher than aluminum oxide ceramic packages, and at a considerably lower cost than aluminum nitride ceramic.
Helios Crew, Corporation is a subsidiary of SemiLEDs, Inc., a USA LED chip manufacturer traded on Nasdaq under the symbol LEDS. Learn more at www.helioscrew.com
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