MEMSCAP thermally actuated variable optical attenuator demonstrates 200 million cycle+ reliability in die level tests

February 21, 2011 – BUSINESS WIRE — MEMSCAP (NYSE Euronext: MEMS) (Paris:MEMS), micro-electro-mechanical systems (MEMS) technology developer, completed die-level reliability testing beyond 200 millions cycles on its Thermally Actuated Variable Optical Attenuators. MEMS based Variable Optical Attenuators are gaining momentum and market share over competing traditional technologies in optical networks applications ranging from optical modules protection to the growing segment of Power Management, according to MEMSCAP.

Recent die-level tests on the Thermally Actuated MEMS Variable Optical Attenuator product line confirmed that the MEMS devices operate within all specifications even after 200 millions cycles with all optical, mechanical and electrical properties remaining within their strict initial specifications. The key operating parameters of electrical resistance and power consumption of the units exhibit excellent stability over the full duration of the test.

Capitalizing on its optical MEMS intellectual property (IP) in design and manufacturing, MEMSCAP has developed Thermally Actuated Variable Optical Attenuators in Normally Open and Normally Closed configurations, including different die sizes, with or without metalized backside.

MEMSCAP’s Variable Optical Attenuator dies have been designed to fit most packaging technologies available on the market and are said to exhibit superior optical power attenuation stability in closed loop mode.

Fueled by the demand for faster internet connection and multiservice solutions, investments in existing and new optical network infrastructures are steadily growing to benefit the optical networking industry. Optical system integrators are looking for proven high quality and high reliability components to be safely integrated in complex optical modules operating up to 100 GBits.

Optical telecom markets are growing at a 28% CAGR from 2009 to 2014, as MEMS-based VOAs increasingly displace non-MEMS solutions, said Jérémie Bouchaud, director and principal analyst for MEMS and Sensors at IHS iSuppli (see iSuppli H2 2010 High Value MEMS Market Tracker).

MEMSCAP provides innovative MEMS-based products including components, component designs (IP), manufacturing and related services. More information on the company’s products and services can be obtained at

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