By Debra Vogler, senior technical editor

March 9, 2011 — At SPIE Advanced Lithography (2/27-3/3/11, San Jose, CA), David Lam, chairman of Multibeam Corp., and the founder and former CEO of Lam Research, presented the concept of complementary e-beam lithography (CEBL) — a technology that is being used to complement and extend optical lithography for advanced logic ICs.

Listen to David Lam’s interview: Download (iPhone/iPod users) or Play Now

In the podcast interview with Debra Vogler, senior technical editor, Lam discusses the technology in detail, and also cites the inspiration for his paper: a presentation on complementary lithography by Intel Senior Fellow Yan Borodovsky, at last year’s SPIE Advanced Lithography Conference. Also significant to CEBL is a presentation by Sam Sivakumar (Intel Fellow and director of lithography) at Nikon’s LithoVision event this year (2/27/11), in which he discussed how the layout design style of logic devices is migrating from 2D to 1D.

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Lam observes that IC manufacturers will find CEBL beneficial as they search for ways to continue using their optical lithography equipment — especially since so much of it is already amortized. It is anticipated that CEBL will be used in a mix/match manner with optical lithography for low-density critical layers (e.g., vias, line cuts, and contacts) in high-volume manufacturing.

More from SPIE Advanced Lithography 2011:

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