By Debra Vogler, senior technical editor
March 9, 2011 — At SPIE Advanced Lithography (2/27-3/3/11, San Jose, CA), David Lam, chairman of Multibeam Corp., and the founder and former CEO of Lam Research, presented the concept of complementary e-beam lithography (CEBL) — a technology that is being used to complement and extend optical lithography for advanced logic ICs.
In the podcast interview with Debra Vogler, senior technical editor, Lam discusses the technology in detail, and also cites the inspiration for his paper: a presentation on complementary lithography by Intel Senior Fellow Yan Borodovsky, at last year’s SPIE Advanced Lithography Conference. Also significant to CEBL is a presentation by Sam Sivakumar (Intel Fellow and director of lithography) at Nikon’s LithoVision event this year (2/27/11), in which he discussed how the layout design style of logic devices is migrating from 2D to 1D.
Lam observes that IC manufacturers will find CEBL beneficial as they search for ways to continue using their optical lithography equipment — especially since so much of it is already amortized. It is anticipated that CEBL will be used in a mix/match manner with optical lithography for low-density critical layers (e.g., vias, line cuts, and contacts) in high-volume manufacturing.
More from SPIE Advanced Lithography 2011:
- AMAT inspection, Magma yield analysis integration to accelerate litho quals, better chip yields
- SPIE 2011: An ASML review of EUV
- SPIE: A glimpse into Intel’s litho future
- The physics behind Gigaphoton EUV source technology
- Cymer talks EUV source timelines and DUV highlights at SPIE
- EUV, resists, multibeam lithography chat with imec
- SPIE 2011: Where are we now with EUV?
- Carl Zeiss photomask registration correction system, RegC, debuts
- Cymer focus drilling for immersion light sources improves depth of focus by 2x
- Nanometrics launches overlay metrology system, wins order from Asia
- EUV lithography vs EBDW: Interview with Toppan Photomasks at SPIE
- Synopsys lithography verification in Proteus LRC handles EUV, double patterning
- SPIE keynote: Imec installs ASML pre-production EUV scanner NXE:3100
- Brewer Science launches immersion lithography products with OptiStack