March 16, 2011 — EV Group (EVG), wafer bonding and lithography equipment supplier for the MEMS, nanotechnology and semiconductor markets, received an order from new customer Shenyang Silicon Technology Co. Ltd. (SST). SST will use an EVG850LT automated production bonding system for silicon-on-insulator (SOI) wafers in its state-of-the-art SOI production facility to expedite its efforts to ramp up high-volume manufacture of SOI wafers.

SST chose the EVG wafer bonder based on the success of the high-throughput, high-yield EVG850, said president Hai Fengtao, adding that using EVG systems in its facility will "help SST to achieve a smooth technology transfer from R&D to high-volume production, while assuring our customers that they are purchasing wafers manufactured on the industry-standard SOI bonding system."

Research and consulting firm Markets and Markets estimates that the global SOI market will grow at a 15.3% CAGR from 2010 to 2015 to reach $1.3 billion by 2015, driven by applications such as MEMS and microprocessors used in computers and video games. Investments in new manufacturing plants are also fuelling market growth, as well as R&D initiatives and strategic collaborations aimed at launching new technologies and growing the customer base.

EV Group is exhibiting at booth 3101 at SEMICON China in Shanghai through March 17, 2011.

EV Group (EVG) provides wafer-processing equipment for semiconductor, MEMS and nanotechnology applications. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. More information is available at www.EVGroup.com.