March 14, 2011 — Unisem added 12" wafer probing to its test floor in Sunnyvale, CA.  Accretech’s next generation prober, the UF3000EX, offers high-speed wafer handling, a low-noise XY stage, and high accuracy with its OTS (Optical Target Scope) positioning technology. 

"The Accretech UF3000EX provides our factory with a state of the art system for wafer probe that will also give us the option to probe twelve inch wafers. Wafer probe has over the last year become a key part of our business in Sunnyvale," said Marita Erickson, general manager at Unisem Sunnyvale.

Unisem Sunnyvale is actively evolving its test floor with the latest test platforms and equipment, to more accurately reflect the test floors in its 3 high-volume Asia factories (Malaysia, Indonesia, and China), and allow customers access to new, top technologies. Unisem customers can grow business from development in Sunnyvale to volume production in Asia with the same equipment.

Unisem is a global provider of semiconductor assembly and test services (SATS), offering wafer bumping, wafer probing, wafer grinding, a wide range of leadframe and substrate IC packaging, wafer level CSP and RF, analog, digital and mixed-signal test services. Turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization. For more information about Unisem, visit www.unisemgroup.com

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group