April 1, 2011 – Marketwire — NexPlanar Corporation recently completed a $10 million round of Series D funding to expand production capacity for its chemical mechanical planarization (CMP) technology in the U.S. and strategic locations globally.
Existing investors including InterWest Partners, Blue Run Ventures and Intel Capital participated in the round.
"We are going to use this next round of funding to triple production capacity in our new Oregon facility and expand our presence in Asia," said Jim LaCasse, CEO and president of NexPlanar.
NexPlanar is able to modulate CMP pad properties, such as pad hardness, pore size and pore density, to develop customized solutions for demanding semiconductor applications and integration schemes, including those for emerging technologies. They announced late last year a corporate move to larger facilities in Hillsboro, Oregon; and hired former Applied Materials director, Rajeev Bajaj, as their new CTO in March 2011.
"We have proven that we can influence semiconductor market drivers in pad technology, such as very thin film removal, advanced defectivity requirements and multiple integration schemes," commented LaCasse.
NexPlanar builds the next generation of CMP pads for the semiconductor device industry. NexPlanar uses proprietary "nano-domain" technology to improve planarity and across-wafer uniformity. NexPlanar’s "nano-lubricants" and patented molded groove technologies allow for low stress CMP with fewer defects and low slurry consumption processing. See www.nexplanar.com.