Asian foundry inspects micro bumps with Camtek systems

May 26, 2011 — Camtek Ltd. (NASDAQ and TASE: CAMT) received repeat automatic optical inspection (AOI) orders from an Asia-based foundry doing advanced micro bump inspection and metrology.

Systems should be installed during Q2 and Q3 2011.

3D IC technology is trending to advanced micro bumps (>10mm), and may reach up to 1 million bumps per die. Microbumps allow increased device interconnects on a small package footprint. Challenges arise in measuring such small bumps, including efficiently handling huge amounts of data, said Roy Porat, Camtek’s CEO, who expects that this customer will order more in the future. Camtek’s AOI systems combine high performance 2D and 3D metrology and inspection on one platform.

Camtek Ltd’s automated tools enable inspection of semiconductors and printed circuit boards (PCB) & IC substrates, using intelligent imaging, image processing, ion milling and digital material deposition. Learn more at www.camtek.co.il.

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