May 17, 2011 — Lori Nye, Brewer Science, tells us how materials suppliers can take lithography below <10nm cost-effectively, speaking to senior technical editor Debra Vogler at The ConFab.
New innovative processes and materials could be the least costly way to get to <10nm lithography, says Nye, pointing out that EUV costs could prevent some smaller to mid-size fabs from converting. With the right use of materials, one can go 2 or 3 nodes beyond currently accepted lithography limits on exposure tools. While the materials costs are higher, the capital investment is lower than purchasing a new stepper.
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Innovation can be counter-intuitive, Nye notes, and lithography process R&D is not always straightforward. Brewer Science is developing technologies for high-brightness LEDs (HB-LED) fab, which Nye says is not that different than traditional semiconductor R&D strategy. Nye is using The ConFab’s focus on high-growth markets to determine underlying needs in these new areas.
More from The ConFab:
- Silicon Valley upstate: NY’s semiconductor manufacturing ambitions
- 2012 and onward for semiconductor fab managers
- 3D packaging disrupts the IC supply chain
- Preparing, recovering from the Japan quake: One company’s response and plan
- Connecting investments to industry trends
- Customers, logic reshaping supplier collaboration landscape
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