May 25, 2011 — Semiconductor packaging and die specialist Chip Supply Inc. in Orlando, FL, is changing its name to Micross Components, which reflects the acquisition of Chip Supply last November by Micross Components in Los Angeles, CA. Micross provides specialist products and services for high-reliability electronics for high-reliability, industrial, and commercial applications.

Chip Supply, which provides interconnects on bare die, chip scale packaging (CSP), and multi-chip modules (MCM) has begun using the name Chip Supply Inc., doing business as Micross Components, and eventually will drop the Chip Supply name altogether, says Alan Taylor, chief executive officer of Micross.

Operations at the Chip Supply Orlando facility, which has 150 employees, five buildings, and 42,000 square feet of processing space, will continue as before the acquisition, and Orlando will become the base for all Micross die business in the United States.

Micross executives are consolidating the company’s Fairfield, NJ, operations in Orlando. Eventually the company will consolidate its operations in Austin, TX, at the Orlando site as well.

The Micross facility in Hatfield, PA, will continue operating as the company’s main US site for all Micross interconnect products and component modification services.

The Chip Supply operations in Orlando provide semiconductor interconnect, test, and assembly services. The Orlando campus has 10,000 square feet of cleanroom space in two cleanrooms, as well as wafer-processing and -encapsulation equipment for post-wafer fabrication semiconductor processing. For more information contact Chip Supply online at www.chipsupply.com, or Micross Components at www.micross.com.

Originally posted by John Keller of Military & Aerospace Electronics