Leadframe package design tool combines CAD Design, Cadence IP

May 4, 2011 — CAD Design Software Inc., mechanical and electrical design tool maker, combined its Electronics Packaging Designer (EPD) and Cadence Design Systems’ Allegro IC Package design and analysis environment to create a "Silicon Realization" flow for ICs in leadframe packages.

Newer low-cost leadframes can be used to package ICs with higher IO counts. Lead frame designs with IO counts in the hundreds require Silicon Realization tools that enable chip/package/board co-design, complex wirebonding with 3D design rule checks, and characterization and modeling tools. CAD Design Software integrates mechanical design packages, where a typical leadframe package is initially designed, with the Cadence Allegro IC Packaging tools where constraint-driven organic and ceramic substrate packages have typically been designed.

Freescale Semiconductor is an early adopter of the converged solution and helped refine the flow. "The collaboration between CAD Design Software and Cadence has greatly reduced the difficulty in designing complex Lead Frame packages. This integration has significantly reduced our design cycle time," reported Neil Tracht, Freescale design manager.

CAD Design Software’s Electronics Packaging Designer (EPD) AutoCAD-based software suites are tailored to applications such as PCB, Flex, Lead Frame, Ceramic (Hybrid/MCM/ LTCC/Thick Film/Thin Film), RF/Microwave, IC Packaging, IC Test, CAM and other design technologies. CAD Design Software is a subsidiary of CAD Design Services Inc. More information about the company, its products, and services is available at www.CAD-Design.com.

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