May 18, 2011 — Since the beginning of 2011, the supply chain has been secure and ready to make the wafer size transition from 300mm to 450mm, says Tom Jefferson, 450mm program manager, ISMI, in this video interview at The ConFab 2011.
Fundamentally, the entire supply chain needs to be ready at the same time for any major technology or process transitions. If some tools are ready and some are not, that poses a challenge, Jefferson notes.
Jefferson also updates us on ISMI’s program. ISMI expects the consortium to grow substantially over the next year, with additional staff and several new tools.
More from the ConFab:
- Intel’s take on chip revenue growth, R&D spending, and design scaling
- Bring lithography <11nm with materials, not new steppers, says Brewer Science
- Customers, logic reshaping supplier collaboration landscape
- Connecting investments to industry trends
- Preparing, recovering from the Japan quake: One company’s response and plan
- Silicon Valley upstate: NY’s semiconductor manufacturing ambitions
- 2012 and onward for semiconductor fab managers
- 3D packaging disrupts the IC supply chain
- KLAC: Yields are key to low costs, in traditional chips and emerging LEDs
- Supply? Tight. Demand? High. Bill McClean forecasts a good year for ICs
- Confab 2011: Making progress with EUV
- EUV, DSA ready at 11nm