Power supply in package, on chip: Where is this market headed?

May 26, 2011 — Anagenesis Inc. released a market report on quantifying the emerging market of miniature integrated power supplies (MIPS). "Market Report: Power Supply in a Package (PSiP) & Power Supply on a Chip (PwrSoC) –The Ultimate Density Challenge 2008 – 2015" covers PSiP/PwrSoC market opportunities and technical challenges.

PSiP has built momentum in becoming a mainstream solution for point-of-load (POL) proximity power sourcing for information and graphics processing chips, lighting and battery charging. PwrSoC devices represent the next evolution in high-density applications, says Anagenesis, and explains why in the report.

PSiP and PwrSoC are "game-changing" power management developments, said Arnold Alderman, Anagenesis president, as information systems move toward higher functional density. These systems require higher-density power sources achieved by >2MHz switching-frequency converters. "Embedded or ‘down’ power solutions are reaching their frequency limit and the PSiP and PwrSoC are becoming the optimum cost/performance method to power next-generation systems."

The report is geared toward designers, technologists, business planners, and investors, sharing product forecasts and technology trends through 2015. The report grades 32 potential MIPS players on market readiness. Anagenesis compiled the data from ongoing technologist/business exec interviews started in 2007.

Anagenesis Inc. is a technical marketing company that combines engineering and marketing perspectives to business planning and execution. Learn more at http://www.anagenesis-inc.com/psip_report_flyer.htm

Also read: Potential $45B power device market looks to new substrates, packaging, process flows by Dr. Paula Doe, contributing editor, SEMI

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