Wafer-level MEMS mic debuts from 3S

May 3, 2011 — Solid State System Co., Ltd (3S), an IC design house, released engineering samples of its wafer-level micro electromechanical system (MEMS) microphone. SSSM100 is a tiny analog output CMOS MEMS microphone manufactured under standard CMOS process and wafer level packaging (WLP) technology.

Differing from most of the other MEMS microphones that need separate chips, SSSM100 has successfully integrated the MEMS sensor and the amplifier onto one single chip. 3S expects the resulting small form factor to give users flexibility in design. Engineering samples are available.

Solid State System Co., Ltd (3S) provides IC design and related test equipment for Flash Data Storage Controller ICs, Multi-media ICs, as well as a line of non-volatile Memory ASICs, and now MEMS. Learn more at www.3system.com.tw

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