June 16, 2011 — Mentor Graphics Corporation (NASDAQ:MENT), in a cooperative effort with Tezzaron Semiconductor and MOSIS, created a process for economically developing and manufacturing 3D-IC prototypes on multi-project wafers (MPWs). The process enables designs using tens of millions of through silicon vias (TSVs) with dimensions as small as 1.2 x 6µm and 2.4µm pitch, producing up to 300,000 vertical interconnects per mm2.
MOSIS’s Multi Project Wafer (MPW) services now allow users, via Tezzaron, to test out 3D-IC concepts using the same provider and model they currently use for their standard semiconductors, said Wes Hansford, director at MOSIS, who added that resource and schedule coordination reduces the "effort and risk" in moving silicon roadmaps forward. MOSIS manages MPW projects including reticle creation, fab reservations, final packaging and testing, and other logistics.
Tezzaron enhances customer designs as required for successful 3D-IC integration and also provides backend manufacturing steps including wafer thinning, backside metal and wafer bonding.
Mentor Graphics provides DRC and LVS tools that support 3D-IC physical verification, ensuring that designs are correct and will meet 3D process requirements. Mentor Graphics brings production-certified Calibre solutions to the prototyping step, verifying that "3D-IC designs are manufacturable," said Joseph Sawicki, VP and GM of the Design-to-Silicon Division at Mentor Graphics. "The Calibre solution uses foundry-certified PDKs from MOSIS wafer suppliers with extensions for MOSIS-Tezzaron 3D-IC designs."
Customers can use the 3D-IC service to create proof-of-concept ICs that demonstrate the use of high-density TSVs in stacked die configurations for intelligent sensor, multi-core processor and many other applications.
MOSIS is a low-cost prototyping and small-volume production service for VLSI circuit development. For more information about the 3D-IC prototyping service, visit www.mosis.com.
Tezzaron Semiconductor specializes in 3D wafer stacking, TSV processes, and cutting-edge memory products. Learn more at www.tezzaron.com
Mentor Graphics Corporation (NASDAQ:MENT) provides electronic hardware and software design solutions. Learn more at http://www.mentor.com/.
Subscribe to Solid State Technology/Advanced Packaging.
Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group