June 24, 2011 — 3M, semiconductor packaging materials supplier, opened an application laboratory in Yangmei, Taiwan, for 200mm and 300mm temporary wafer bonding. The 3M Semiconductor Innovation Center will serve the Asia region with 3M’s Wafer Support System (WSS) materials and processes for temporary bonding for ultra-thin wafer handling applications for 3D integrated circuit (IC) packaging.
The 3M Wafer Support System includes equipment and materials that allow temporary wafer bonding to support wafer thinning and subsequent processing of ultra-thin wafers for 3D packaging.
3M already operates wafer support applications laboratories in Japan and the US.
Customers at the Taiwan lab will be able to test 3M WSS capabilities using materials like 3M’s Liquid UV-Curable Adhesives and Light-To-Heat Conversion (LTHC) coating. The goal is for customers to develop Wafer bonding and debonding processes for high volumes on thin wafers while maintaining high yields, avoiding unneccessary stresses and high heats on the wafers, said 3M in a statement.
3M’s sophisticated UV curable adhesives for wafer bonding to glass carriers offer fast cure cycle with a rigid bond that survives intense grinding and subsequent processing after the wafers are thinned. The 3M adhesive and glass system provides excellent support. 3M LTHC Coating decreases stresses on ultra-thin wafers with room-temperature debonding of the thinned wafer directly to a tape carrier. The thinned wafer is supported throughout the entire process.
For more information about 3M Electronics Markets Materials Division, its products and services visit www.3M.com/wss
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