AMAT RTP heats wafer backside for better temp uniformity

June 29, 2011 — Applied Materials Inc. (AMAT) launched the Applied Vantage Vulcan rapid thermal processing (RTP) system for wafer annealing. The AMAT tool improves wafer uniformity by way of backside heating, even for 20nm transistors. The Vantage Vulcan joins AMAT’s Vantage line of RTP tools for wafer processing.

Applied Materials designed the Vantage Vulcan to eliminate hot spots on wafers caused by direct radiant heating. The RTP tool applies heat entirely to the unpatterned backside of the wafer and uses AMAT’s honeycomb lamp array, acheiving within-die temperature uniformity to less than


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