DuPont perfluoroelastomer parts won’t erode in wafer processing

June 29, 2011 — DuPont Performance Polymers (DuPont) will introduce DuPont Kalrez 9300 and 9500 perfluoroelastomer parts for semiconductor wafer processing at Semicon West Booth 2523 in San Francisco, July 12-14.

Kalrez 9300 parts offer balanced performance in remote and in-situ plasma etch. In demanding deposition processes where ozone is prominent, Kalrez 9500 demonstrates excellent resistance process chemistry.

Kalrez 9300, based on a proprietary DuPont crosslinking and mechanical reinforcement system, resists aggressive oxygen and fluorine-based plasma during wafer etch. Seals are not eroded even under ion-rich conditions, says DuPont.

For sub-atmospheric chemical vapor deposition (SACVD) and ash/strip processes, Kalrez 9500 reportedly offers ultra-low weight loss in remotely generated plasma and resists ozone, ammonia and water vapor. Kalrez 9500 also offers heat resistance with very low outgassing and has a maximum continuous service temperature rating of 310


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