June 27, 2011 — Endicott Interconnect Technologies released an update on its defense electronics development and production and sustainment contracts, which totalled $101 million from the Defense Department from 2010 to present.
EI’s work with the Defense Department uses "some of the most advanced electronic packaging" available, said Eric Hills, vice president — business development/program office at EI.
EI said it was awarded development and production contracts totaling $89.4 million for the continued development of high-performance computing systems for the Defense Department throughout 2010. EI was awarded two hardware sustainment contracts in 2011, valued at $2.1 million and $9.5 million. The latter is a 10-year contract.
Since the initial contract awards in 2008 and 2009, EI has conducted research and development of system architecture and advanced, high-speed electronics packaging technologies, including building engineering hardware to support design verification and system capability enhancements. A production contract for this new system was made to EI at the end of 2010.
EI, based in Endicott, provides high-performance electronic packaging solutions for customers in the defense, aerospace, communications, computing, semiconductor, advanced test equipment and medical markets. Learn more at http://www.endicottinterconnect.com/index.php
Past EI defense news:
- DoD Supplements EI’s MCM Contract (2007)
- Fed Invests $6M For Anti-tampering Chips from Endicott Interconnect (2009)
- New EI LCP laminates meet harsh environment SiP reqs (2010)
Subscribe to Solid State Technology/Advanced Packaging.
Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group