June 8, 2011 – Marketwire — FormFactor Inc. (NASDAQ:FORM) introduced its new generation of the SmartMatrix 300mm full wafer contact probe cards for DRAM device test.

The SmartMatrix 100XP probe card uses FORM’s MicroSpring 3D MEMS contact technology and increases probe card parallelism to over 850 die (60% more than the SM100 platform), enabling single touchdown DRAM wafer test. Custom ICs, and advanced multichip module (MCM) packaging, enhance tester resource sharing to increase test cell parallelism.

DRAM manufacturers and test houses can use the SmartMatrix 100XP on new and existing test equipment.

The probe card also reportedly improves high-frequency (HF) signal fidelity during test. FormFactor’s "DUTlet" or Device Under Test partitioned product architecture improves signal and power integrity for better low-noise testing on 3X and 2X nm node low-voltage LPDDR2 mobile and DDR3 commodity DRAM components. Yields and test times are improved by the reduced noise, says FormFactor.

Scrub and thermal performance were improved over previous product generations. Smaller and more controlled scrub mark distribution has helped reduce pad damage with the SmartMatrix 100XP by as much as 15%. FORM expects this will allow cost-effective Known Good Die (KGD) testing for 3D applications.

FormFactor Inc. (FORM) has shipped 600 Matrix-family wafer probe cards: TouchMatrix, TrueScale Matrix and SmartMatrix. The company offers wafer sort, burn-in and device performance testing products. For more information, visit www.formfactor.com.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group