Honeycomb heatsink cools BGAs in thin-profile devices

June 7, 2011 — JaroThermal’s Honeycomb heatsink directs heat towards the outside of the device, while Click to Enlargeproducing a steady flow of cool air inside the heatsink. Honeycomb heatsinks can be used with either plastic or metal/ceramic BGA packages, depending on the thermal interface material (TIM).

The design is studded with holes, helping increase surface area and cross ventilation. Ambiant air is cooled even as heat is released.

Applications include video cards, motherboards and networking applications. The design is thin, suiting compact, low-profile designs.

JARO’s adhesive mounted version eliminates the need for mounting holes in the PCB.

Jaro Thermal provides electronics thermal management technologies. Learn more about the product at http://www.jarothermal.com/honeycomb.pdf (PDF)

Click to Enlarge

Also read: Cooling high-power packages by Kaveh Azar, Ph.D. Advanced Thermal Solutions

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.