ITRI installs EVG bonders to ramp 200mm MEMS

June 1, 2011 – PRNewswire — Wafer bonding and lithography equipment maker EV Group (EVG) will join Taiwan’s Industrial Technology Research Institute (ITRI) to research and develop advanced manufacturing processes for next-generation micro electro mechanical system (MEMS) devices.

ITRI uses anodic, eutectic, and metal thermo compression wafer bonding in MEMS fab. EVG will help ITRI create and optimize wafer-level bonding steps. To this end, ITRI purchased an EVG510 semi-automated wafer bonding system and an EVG6200 automated mask alignment system with top-bottom alignment and bond alignment options. They will be installed in the Micro Systems Technology Center at ITRI, alongside the research group’s existing EVG mask aligners and wafer bonding tools.

ITRI plans to ramp 200mm MEMS wafer fab using the EVG510 bonder, and cited tool flexibility and process support from EVG as factors in the purchasing decision. Wafer-level aligned bonding enables MEMS fabs to process the wafer using semiconductor-style steps without damaging the mechanical features within the package. Hermetic seals created in wafer bonding also protect the device from contamination and damage during field operation.

ITRI’s partners and customers will have access to the new wafer processing technologies developed with EVG, said Tzong-Che Ho, director of ITRI’s Micro Systems Technology Center. Their goal is to bring next-generation MEMS into new and expanding applications. In Taiwan, consumer mobile communications and automotive electronics are major production areas; MEMS accelerometers, pressure sensors, gyroscopes, and other devices are increasingly used for these products.

This is a good step in EVG’s long-standing relationship with ITRI, noted Dr. Viorel Dragoi, chief scientist at EV Group, adding that the focus on MEMS process development and pilot production is a good fit for both parties.

ITRI is an international applied technology research organization focused on innovation in Taiwan.

EV Group (EVG) provides wafer-processing toolsets — wafer bonding, lithography/nanoimprint lithography (NIL), metrology equipment, photoresist coaters, cleaners and inspection systems — for semiconductor, MEMS and nanotechnology applications. More information is available at

Also read: Fraunhofer IMS orders Tegal equipment for MEMS fab

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