June 21, 2011 — The JEDEC Solid State Technology Association published a significant revision to JESD9B, Inspection Criteria for Microelectronic Packages and Covers.
JEDEC standard JESD9B allows users to verify quality and requirements of microelectronic packages and covers (lids) on hybrid microelectronic circuits/microcircuits. Package and microcircuit manufacturers implement the standard during incoming inspection of package components through final package inspection.
Metal and ceramic package manufacturers, hybrid/microcircuit/semiconductor manufacturers, and space/aerospace/military and commercial users provided user failure mode histories for the updated standard criteria. New criterion were added and old ones updated based on these data points. The revision aims to increase quality while trimming out unneccessary points. It includes clear and easy-to-interpret color photos or diagrams for every condition listed.
The JC-13.5 Task Group 134 updated the standard. The revised standard may be downloaded free of charge from JEDEC
I write specifications & standards for the Government and an old document states “Four Diameters Magnification” and I need to know a definitive definition on what “Four Diameters Magnification” equates to. I would appreciate whatever you can offer. The phase is used in 2 examples: “The specimens shall be visually
examined at four (4) diameter magnification to determine whether removal has been caused by cutting away of an adherent plate or lifting of a non-adherent plate.” and “The adhesion shall be determined by heating the plated articles at 250° to 300° F for one (1) hour. After removal and cooling, the surface of the articles shall be examined
at four (4) diameter magnifications for any evidence of flaking, peeling or blistering.”
Thank you.
Rich Squillacioti