Korean IDM orders NEXX tools for WLP metallization

June 28, 2011 – BUSINESS WIRE — NEXX Systems, advanced packaging equipment maker, completed a joint evaluation program with a principal Korean integrated device manufacturer (IDM), installing 2 300mm Stratus electrochemical deposition (ECD) systems. The IDM will use its Stratus ECD tools for wafer-level packaging (WLP) metallization processes for cutting-edge mobile products.

The manufacturer needed packaging tools that could handle high-volume manufacturing for advanced mobile devices, noted Rezwan Lateef, VP of business development and customer operations, NEXX Systems.

NEXX Systems opened a Korea subsidiary in collaboration with its sales and service agency in the region, Global Zeus. Bioh Kim is NEXX Systems’ Korea director and GM.

The Stratus production plating tool has 20 wafer plating positions. Its vertical processing technology and single, linear cell configuration enable dual-sided production plating on wafers from 50 to 200

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