LORD underfill encapsulant designed for lower cost

June 15, 2011 — LORD Corporation, thermal management materials, adhesives, coatings and encapsulants supplier, launched the ME-555 underfill encapsulant for semiconductor packaging and assembly. LORD ME-555 is a high-purity, semiconductor-grade epoxy underfill for encapsulating flip chips.

The material was engineered to be lower-cost than competitive underfill materials, the company said in a statement, comparing it to underfills such as Henkel 4526.

The ME-555 is formulated to reduce flip chip die warpage and to withstand overmolding. It can be used under CSP/BGAs and small dies with stand-off heights as small as 25

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